Exposure apparatus and method of manufacturing article

ABSTRACT

The present invention provides an exposure apparatus that exposes a substrate, comprising: an optical system configured to emit, in a first direction, light for exposing the substrate; a first supplier configured to supply a gas into a chamber where the optical system is arranged; and a second supplier configured to supply a gas to an optical path space where the light from the optical system passes through, wherein the second supplier includes a gas blower including a blowing port from which a gas is blown out in a second direction, and the guide member configured to guide the gas blown out from the blowing port to the optical path space, and the guide member includes a plate member extended on a side of the first direction of the blowing port so as to be arranged along the second direction.

BACKGROUND OF THE INVENTION Field of the Invention

The present invention relates to an exposure apparatus and a method ofmanufacturing an article.

Description of the Related Art

As one of apparatuses used in the manufacturing process (lithographyprocess) of a liquid crystal panel, a semiconductor device, or the like,there is an exposure apparatus that projects a pattern image of anoriginal onto a substrate by a projection optical system and exposes thesubstrate. In the exposure apparatus, it is known that when a resist(photosensitive material) applied on a substrate is exposed, a gas(outgas) is generated from the resist. If the outgas reacts with animpurity such as an acid, a base, or an organic substance in thesurrounding atmosphere or in the surface film of an optical element,this causes fogging of an optical element arranged around the substrate.Particularly, an optical element located in the lowermost end of theprojection optical system is arranged facing the substrate, so that itis likely to fog due to the outgas from the resist. If the opticalelement fogs, the light transmittance of the optical element decreases,and this can lead to an insufficient exposure amount, an unevenilluminance, or a flare. Japanese Patent Laid-Open No. 2005-333152proposes an arrangement in which a gas blown downward from a nozzleprovided in the side portion of a projection optical system is guidedalong the curved surface of a guide element by the Coanda effect tosupply the gas between the projection optical system and a substrate.

In the arrangement described in Japanese Patent Laid-Open No.2005-333152, the flow direction of the gas is changed by the Coandaeffect by a guide member, and such a gas has a property of entraining asurrounding gas. Hence, the gas can flow between the optical element ofthe projection optical system and the substrate while entraining anoutgas generated from a resist. Therefore, the outgas reaching theoptical element of the projection optical system (that is, fogging ofthe optical element) cannot be sufficiently avoided.

SUMMARY OF THE INVENTION

The present invention provides an exposure apparatus advantageous in,for example, reducing fogging of an optical element in an opticalsystem.

According to one aspect of the present invention, there is provided anexposure apparatus that exposes a substrate, comprising: an opticalsystem configured to emit, in a first direction, light for exposing thesubstrate; a first supplier configured to supply a gas into a chamberwhere the optical system is arranged; and a second supplier configuredto supply a gas to an optical path space where the light from theoptical system passes through, wherein the second supplier includes agas blower and a guide member, the gas blower including a blowing portfrom which a gas is blown out in a second direction at a flow velocityhigher than a flow velocity of a gas blown out from the first supplier,and the guide member being configured to guide the gas blown out fromthe blowing port to the optical path space, and the guide memberincludes a plate member extended on a side of the first direction of theblowing port so as to be arranged along the second direction in whichthe gas is blown out from the blowing port.

Further features of the present invention will become apparent from thefollowing description of exemplary embodiments with reference to theattached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a view showing the overall arrangement of an exposureapparatus;

FIGS. 2A and 2B are views each showing an arrangement example of asecond supplier according to the first embodiment;

FIG. 3 is a view showing an arrangement example in which the secondsupplier according to the first embodiment is attached to a projectionoptical system;

FIGS. 4A to 4D are views each showing an arrangement example and a shapeexample of a blowing port inside a guide member;

FIG. 5 is a view showing a modification of the second supplier accordingto the first embodiment;

FIGS. 6A and 6B are views each showing another modification of thesecond supplier according to the first embodiment;

FIGS. 7A and 7B are views each showing still another modification of thesecond supplier according to the first embodiment;

FIG. 8 is a view showing an arrangement example of a second supplieraccording to the second embodiment;

FIG. 9 is a view showing an arrangement example of a second supplieraccording to the third embodiment;

FIG. 10 is a view showing an arrangement example of a second supplieraccording to the fourth embodiment;

FIG. 11 is a view showing an arrangement example of a second supplieraccording to the fifth embodiment; and

FIG. 12 is a view showing an arrangement example of a second supplieraccording to the sixth embodiment.

DESCRIPTION OF THE EMBODIMENTS

Hereinafter, embodiments will be described in detail with reference tothe attached drawings. Note, the following embodiments are not intendedto limit the scope of the claimed invention. Multiple features aredescribed in the embodiments, but limitation is not made an inventionthat requires all such features, and multiple such features may becombined as appropriate. Furthermore, in the attached drawings, the samereference numerals are given to the same or similar configurations, andredundant description thereof is omitted.

First Embodiment

The first embodiment according to the present invention will bedescribed. FIG. 1 is a view showing the overall arrangement of anexposure apparatus 100 according to this embodiment. The exposureapparatus 100 according to this embodiment is a step-and-scan exposureapparatus that exposes a substrate W while scanning an original M andthe substrate W, thereby transferring the pattern of the original M ontothe substrate. The exposure apparatus 100 is also called a scanningexposure apparatus or a scanner. In this embodiment, the original M is,for example, a mask (reticle) made of quartz, on which a circuit patternto be transferred onto each of a plurality of shot regions on thesubstrate W has been formed. The substrate W is a wafer coated with aphotoresist and, for example, a single crystal silicon substrate or thelike can be used. Note that in this embodiment, a step-and-scan exposureapparatus is exemplarily described, but the present invention is alsoapplicable to a step-and-repeat exposure apparatus.

The exposure apparatus 100 can include an illumination optical system 1,an original stage 2 that can move while holding the original M, aprojection optical system 3, a substrate stage 4 that can move whileholding the substrate W, and a controller 5. The controller 5 is formedby, for example, a computer that includes a CPU and a memory, and iselectrically connected to respective units in the apparatus, therebycomprehensively controlling the overall operation of the apparatus. Inthe following description, a direction parallel to the optical axis oflight emitted from the projection optical system 3 and strikes thesubstrate W is assumed to be the Z-axis direction, and two directionsorthogonal to each other in a plane perpendicular to the optical axisare assumed to be the X-axis direction and the Y-axis direction,respectively. Note that in the following description, the “X-axisdirection” can be defined to include the +X direction and the −Xdirection. This also applies to the “Y-axis direction” and the “Z-axisdirection”.

The illumination optical system 1 shapes light emitted from a lightsource LS such as a mercury lamp, an ArF excimer laser, or a KrF excimerlaser into, for example, band-like or arcuate slit-shaped light, andilluminates a portion of the original M with this slit-shaped light. Thelight transmitted through the portion of the original M enters theprojection optical system 3 as a pattern light reflecting the pattern ofthe portion of the original M. The projection optical system 3 has apredetermined projection magnification, and projects the pattern imageof the original M onto the substrate (more specifically, the resist onthe substrate) by using the pattern light. The original M and substrateW are respectively held by the original stage 2 and substrate stage 4,and are arranged in optically conjugate positions (the object plane andimage plane of the projection optical system 3) via the projectionoptical system 3. The controller 5 relatively scans, in a predeterminedscanning direction (for example, the X direction), the original stage 2and substrate stage 4 in synchronism with each other at a velocity ratiomatching the projection magnification of the projection optical system3. With this arrangement, the pattern of the original M can betransferred onto the substrate. Here, in this embodiment, each of theillumination optical system 1 and the projection optical system 3 isconfigured to emit light downward (−Z direction or first direction).Therefore, in the description below, “lower” is used to mean the side ofthe direction (−Z direction side or the first direction side) in whichlight is emitted from the illumination optical system 1 and theprojection optical system 3.

The exposure apparatus 100 also includes a first supplier 7 thatsupplies, to the inside of a chamber 6 (into the chamber) in which theprojection optical system 3 is arranged, a gas 41 (for example, cleanair) from a first gas supply source 31. For example, the first supplier7 can be configured as a circulatory gas supply mechanism that generatesa predetermined airflow inside the chamber 6. In this case, the firstgas supply source 31 includes, for example, a fan, a filter, and thelike, and is configured to send the gas drawn from the inside of thechamber by a drawer 33 to the first supplier 7. Then, the first supplier7 can generate the predetermined airflow inside the chamber 6 by blowingout the gas 41 sent (supplied) from the first gas supply source 31 intothe chamber. Here, a gas blowing port in the first supplier 7 may beprovided in, for example, the inner surface (for example, the wallportion) of the chamber 6, or may be provided (arranged) inside thechamber 6. The first gas supply source 31 may be a component of theexposure apparatus 100, but may not be a component of the exposureapparatus 100 when it is applied to an equipment or the like of afactory where the exposure apparatus 100 is installed. Note that in thearrangement example of the exposure apparatus 100 shown in FIG. 1, theillumination optical system 1 is also provided with the first supplier7.

In the exposure apparatus 100, it is known that when a resist(photosensitive material) applied onto a substrate is exposed, a gas(outgas 50) is generated from the resist. If this outgas 50 reacts withan impurity such as an acid, a base, or an organic substance in thesurrounding atmosphere or in the surface film of an optical element,this causes fogging of an optical element arranged around the substrateW. Particularly, an optical element (for example, a lens, a glass plate,or a mirror) located in the lowermost end of the projection opticalsystem 3 is arranged facing the substrate W, so that it is likely tocause fogging due to the outgas 50 from the resist. If the opticalelement fogs, the light transmittance of the optical element decreases,and this can lead to an insufficient exposure amount, an unevenilluminance, or a flare. Therefore, the exposure apparatus 100 accordingto this embodiment includes a second supplier 8 that supplies a gas 42to an optical path space S where light (pattern light) from theprojection optical system 3 passes through. The specific arrangement ofthe second supplier 8 will be described below.

[Arrangement of Second Supplier]

FIGS. 2A and 2B are views each showing an arrangement example of thesecond supplier 8 according to this embodiment. In addition to thesecond supplier 8, each of FIGS. 2A and 2B shows a part of theprojection optical system 3 around the second supplier 8, the substrateW, and the substrate stage 4. The examples shown in FIGS. 2A and 2B aredifferent in the arrangement of a gas exhauster 9, but similar in theremaining arrangement (the arrangement of the second supplier 8 or thelike). The gas exhauster 9 is a mechanism that exhausts a gas havingpassed through the optical path space S to the outside. As shown in eachof FIGS. 2A and 2B, in the lower portion (−Z direction side or the firstdirection side) of the projection optical system 3, the gas exhauster 9can be arranged on the opposite side of the second supplier 8 withrespect to the optical path space S. The gas exhauster 9 may beconfigured to draw the gas from an opening 9 a provided on the substrateW side and exhaust it as shown in FIG. 2A, or may be configured to drawthe gas from an opening 9 b provided on the second supplier 8 side andexhaust it as shown in FIG. 2B.

The second supplier 8 includes a gas blower 10 and a guide member 20(rectifier), and is configured (arranged) so as to supply the gas 42 tothe optical path space S where light (pattern light) from the projectionoptical system 3 passes through. Here, for example, the optical pathspace S may be defined as a space between an optical element 3 a, whichis located in the lowermost end of the projection optical system 3 andfaces the substrate W, and the substrate W held by the substrate stage4. The optical element 3 a may be, for example, a light transmittingelement such as a lens or a glass plate that transmits light, or may bea light reflecting element such as a mirror that reflects light.

The gas blower 10 includes a blowing port 11 from which a gas 43 (forexample, clean air or nitrogen gas) is blown out at a flow velocityhigher than the flow velocity of the gas 41 blown out from the firstsupplier 7. The gas blower 10 is formed as a tube that defines the gasflow path, and the upstream side (an end portion on the opposite side ofthe blowing port 11) thereof is connected to a utility. For example, asshown in FIG. 1, the gas blower 10 is connected to a second gas supplysource 32 different from the first gas supply source 31 which is used tosend the gas 41 to the first gas supplier 7, and configured to blow out,from the blowing port 11, the gas sent (supplied) from the second gassupply source 32. Here, the second gas supply source 32 may be acomponent of the exposure apparatus 100, but may not be a component ofthe exposure apparatus 100 when it is applied to an equipment or thelike of a factory where the exposure apparatus 100 is installed. Whenthe second gas supply source 32 is arranged as a component of theexposure apparatus 100, the second gas supply source 32 includes, forexample, a fan, a compressor, an evaporator, a high-pressure cylinder,and the like, and a pressure regulator can be provided.

The guide member 20 is a member that guides (rectifies), to the opticalpath space S, the gas 43 blown out from the blowing port 11. The guidemember 20 includes a first plate member 21 (lower plate member) extendedbelow (the −Z direction side or the first direction side) of the blowingport 11 so as to be arranged along the blowing direction (−Y directionor second direction) of the gas 43 from the blowing port 11 of the gasblower 10. The first plate member 21 includes a first end portion 21 awhich is closer to the optical path space S than the blowing port 11 ofthe gas blower 10, and a second end portion 21 b which is farther fromthe optical path space S than the blowing port 11. That is, the blowingport 11 of the gas blower 10 is arranged between the first end portion21 a and the second end portion 21 b of the first plate member 21 in theblowing direction of the gas 43. Here, the first end portion 21 a of thefirst plate member 21 is arranged below the projection optical system 3,and preferably arranged below a part of the optical element 3 a of theprojection optical system 3. On the other hand, the second end portion21 b of the first plate member 21 is arranged at a position possiblyspaced apart from the optical path space S, and preferably arrangedoutside the movable range of the substrate W (substrate stage 4). As anexample, the second end portion 21 b of the first plate member 21 can bearranged between the blowing port 11 of the gas blower 10 and the gasblowing port of the first supplier 7. With this arrangement, it ispossible to reduce entrainment of the outgas 50 generated from thesubstrate W into the gas 43 blown out from the blowing port 11, so thata cleaner gas can be supplied to the optical path space S.

In this embodiment, in addition to the first plate member 21, the guidemember 20 is configured to further include a second plate member 22(upper plate member) extended above the blowing port 11 so as to facethe first plate member 21. That is, the second plate member 22 isextended on the opposite side of the first plate member 21 (+Z directionside of the blowing port 11) with respect to the blowing port 11 so asto face the first plate member 21. The guide member 20 is formed in atubular shape in which parts (lower surface and upper surface) of theinner surface are defined by the first plate member 21 and the secondplate member 22, respectively. In this case, in the tubular guide member20, a first opening 20 a whose one side is defined by the first endportion 21 a of the first plate member 21, and a second opening 20 bwhose one side is defined by the second end portion 21 b of the firstplate member 21 on the opposite side of the first opening 20 a can beformed.

The gas blower 10 is formed such that the blowing port 11 is arrangedbetween the first opening 20 a and the second opening 20 b inside thetubular guide member 20 and the area of the blowing port 11 is smallerthan the sectional area (X-Z sectional area) of the guide member 20. Asan example, the gas blower 10 can include a first tube portion 12including the blowing port 11 as one end and arranged inside the guidemember 20, and a second tube portion 13 extending through the guidemember 20 (second plate member 22) and communicating with the other end(the end portion on the opposite side of the blowing port 11) of thefirst tube portion 12. The second tube portion 13 can be connected tothe second gas supply source 32.

As shown in FIG. 3, the gas blower 10 (first tube portion 12 and secondtube portion 13) may be attached to the projection optical system 3.FIG. 3 is a view showing an arrangement example in which the secondsupplier 8 (gas blower 10) according to this embodiment is attached tothe projection optical system 3. This arrangement can be advantageous inspatial restriction inside the exposure apparatus 100 and reducingfluctuations in the positional relationship between the gas blower 10and the optical element 3 a. Note that the gas exhauster 9 as shown ineach of FIGS. 2A and 2B may also be provided in the arrangement shown inFIG. 3.

The second supplier 8 arranged as described above blows out, in adirection (−Y direction) toward the first opening 20 a of the guidemember 20, the gas 43 from the blowing port 11 of the gas blower 10 at aflow velocity higher than the flow velocity of a gas blown out from thefirst supplier 7. With this arrangement, the gas 41 is drawn from thesecond opening 20 b of the guide member 20, and the gas 41 drawn fromthe second opening 20 b can be blown out from the first opening 20 a ofthe guide member 20 to the optical path space S together with the gas 43from the blowing port 11. That is, it is possible to supply the gas 42of a flow amount larger than the flow amount of the gas 43 blown outfrom the blowing port 11 by the amount of the gas 41 drawn from thesecond opening 20 b of the guide member 20.

This principle will be described in detail. When the gas 43 is blown outfrom the blowing port 11 of the gas blower 10 at a flow velocity higherthan the flow velocity of the gas 41 blown out from the first supplier7, the gas 41 is drawn around the blowing port 11 inside the guidemember 20 and, as a result, a low pressure (negative pressure) isgenerated around the blowing port 11. Thus, the gas 41 is drawn (sucked)into the guide member 20 in accordance with a blowout of the gas 43 fromthe blowing port 11. Here, since the blowing port 11 is surrounded bythe guide member 20, the intake port of the gas 41 is limited to thefirst opening 20 a or the second opening 20 b. However, since the gas 43blown out from the blowing port 11 flows in the −Y direction, the gasflow inside the guide member 20 is formed in a direction from the secondopening 20 b to the first opening 20 a. Accordingly, the gas 41 is drawn(sucked) from the second opening 20 b. On the other hand, almost no gasis drawn from the first opening 20 a due to the blowing direction of thegas 43 from the blowing port 11. Therefore, it is possible to blow out,from the first opening 20 a of the guide member 20 to the optical pathspace S, the gas 42 of a flow amount equal to or larger than the flowamount of the gas 43 supplied to the blowing port 11 of the gas blower10.

Here, it is unnecessary that the arrangement direction from the secondopening 20 b to the first opening 20 a in the guide member 20 matchesthe direction of the gas 41 blown out from the gas blowing port of thefirst supplier 7. As has been described above, the drawn direction ofthe gas 41 is determined by the blowing direction of the gas 43 from theblowing port 11 and the direction of the guide member 20. However, interms of drawing the cleaner gas 41 including no outgas 50, the blowingdirection of the gas 41 from the first supplier 7 preferably matches thearrangement direction from the second opening 20 b to the first opening20 a. Further, in terms of including no outgas 50, the second opening 20b need only be located at a position away from the optical path space S,but the second opening 20 b is preferably arranged near the gas blowingport of the first supplier 7. With this arrangement, it is possible todraw, from the second opening 20 b, the clean gas 41 blown out from thegas blowing port of the first supplier 7 and supply it from the firstopening 20 a to the optical path space S.

Next, the position and shape of the blowing port 11 (first tube portion12) of the gas blower 10 will be described. In the second supplier 8shown in each of FIGS. 2A and 2B, the blowing port 11 of the gas blower10 is arranged to be spaced apart from the first plate member 21 andprovided in the second plate member 22 inside the guide member 20, butthe present invention is not limited to this. The blowing port 11 of thegas blower 10 may be arranged at an arbitrary position inside the guidemember 20 and have an arbitrary shape as long as the area of the blowingport 11 is smaller than the sectional area (X-Z sectional area) of theguide member 20. For example, the blowing port 11 of the gas blower 10may be provided in the first plate member 21, or may be arranged to bespaced apart from both the first plate member 21 and the second platemember 22 (for example, may be arranged in the central portion of theguide member 20).

Each of FIGS. 4A to 4D is a view of the second supplier 8 when viewedfrom the −Y direction side, and shows an arrangement example and a shapeexample of the blowing port 11 of the gas blower 10 inside the guidemember 20. The position and shape of the blowing port 11 can bedetermined, for example, in accordance with the flow velocitydistribution of the gas 42 to be supplied to the optical path space S.For example, the blowing port 11 may have a rectangular shape (straightshape) as shown in FIG. 4A, or may have a curved shape (arcuate shape)as shown in FIG. 4B. Each of these arrangements is effective in a casein which the −Y direction flow velocity of the gas supplied from thesecond supplier 8 to the optical path space S is changed in accordancewith the optical axis direction (Z-axis direction) of light from theprojection optical system 3. In each of the arrangement examples shownin FIGS. 4A and 4B, the blowing port 11 is provided in the upper surface(second plate member 22) of the guide member 20. Hence, the flowvelocity of the gas in the optical path space S can be increased as thegas is closer to the optical element 3 a of the projection opticalsystem 3 (that is, decreased as the gas is closer to the substrate W).On the other hand, in order to decrease (uniformize) a difference in −Ydirection flow velocity of the gas in the optical axis direction in theoptical path space S, the blowing port 11 can be arranged/formed asshown in each of FIGS. 4C and 4D. In each of the arrangement examplesshown in FIGS. 4C and 4D, the blowing port 11 is provided not only inthe upper surface (second plate member 22) of the guide member 20 butalso in the side surface (X-axis direction side) or the lower surface(first plate member 21) of the guide member 20.

Here, the arrangement of the second supplier 8 that enables efficientlydrawing of the gas 41 from the second opening 20 b of the guide member20 will be described. In the arrangement of the second supplier 8according to this embodiment as described above, the area of the blowingport 11 is made smaller than the sectional area of the guide member 20so as to increase the blowing flow velocity of the gas 43 from theblowing port 11. The smaller the area of the blowing port 11, the morethe gas can be efficiently drawn from the second opening 20 b of theguide member 20 in accordance with a blowout of the gas 43 from theblowing port 11. The reason for this is that the smaller the area of theblowing port 11, the lower the pressure around the blowing port 11 canbe made inside the guide member 20. As an example, when the blowing port11 is formed in the rectangular shape as shown in FIG. 4A, the smalleran opening height h1 of the blowing port 11 than a sectional height h2of the guide member 20, the more efficiently the gas 41 can be drawnfrom the second opening 20 b of the guide member 20. The opening heighth1 of the blowing port 11 is preferably equal to or smaller than a half(more preferably, equal to or smaller than ⅓ or ¼) of the sectionalheight h2 of the guide member 20. In terms of the area, the sectionalarea of the blowing port 11 is preferably equal to or smaller than ¼(more preferably, equal to or smaller than 1/9 or 1/16) of the sectionalarea of the guide member 20.

As an example, assume a case in which the blowing port 11 of the gasblower 10 is formed in the rectangular shape as shown in FIG. 4A and thesectional height h2 of the guide member 20 is 5 mm. In this case, whenthe ratio of the opening height h1 of the blowing port 11 to thesectional height h2 of the guide member 20 is about 1:7, it is possibleto blow out, from the first opening 20 a of the guide member 20, the gas42 of a flow amount 2.5 times larger than the flow amount of the gas 43blown out from the blowing port 11. Note that the dimensions (forexample, height) of each of the guide member 20 and the blowing port 11can be arbitrarily set. For example, the dimensions of the first opening20 a and the second opening 20 b of the guide member 20 can bearbitrarily set in accordance with the distance (several mm to severalten mm) between the optical element 3 a of the projection optical system3 and the substrate W. For example, in order to efficiently draw the gas41 from the second opening 20 b into the guide member 20, as shown inFIG. 5, the guide member 20 may be formed such that the opening area ofthe second opening 20 b is larger than the opening area of the firstopening 20 a. In this case, the opening height of the second opening 20b may be larger than the distance between the optical element 3 a andthe substrate W. As another arrangement for efficiently drawing the gas41, as shown in FIG. 6A, the guide member 20 may be formed such that thefirst plate member 21 and the second plate member 22 of the guide member20 are made to have different lengths so as to form the large secondopening 20 b. Alternatively, as shown in FIG. 6B, the second opening 20b may have a reverse taper shape (that is, a shape in which thesectional area increases toward the second opening 20 b) to efficientlydraw the gas 41.

Alternatively, as a method of increasing the flow velocity of the gas 43from the blowing port 11, as shown in each of FIGS. 7A and 7B, the shapeof the blowing port 11 or the shape of the tube portion (first tubeportion 12 and second tube portion 13) of the gas blower 10 may bechanged. For example, as shown in each of FIGS. 7A and 7B, each of thefirst tube portion 12 and the second tube portion 13 can be formed in acurved shape, or may be tapered toward the blowing port 11. Further, asshown in FIG. 7B, when the exit portion of the blowing port 11 in thegas blower 10 is formed to have a curved surface shape so as to allowthe gas 43 to flow along the second plate member 22, the flow velocityof the gas 43 from the blowing port 11 can be increased.

The distance (Y-axis direction) between the blowing port 11 of the gasblower 10 and the first opening 20 a of the guide member 20 ispreferably larger than, for example, the value of the opening height h2of the first opening 20 a. That is, the blowing port 11 is preferablyarranged on the inner side (+Y direction side) of the guide member 20from the first opening 20 a by the distance larger than the value of theopening height h2 of the first opening 20 a. With this arrangement, thegas flowing from the first opening 20 a into the guide member 20 (thatis, a counterflow of the gas) can be reduced. The closer the position(Y-axis direction) of the blowing port 11 is to the first opening 20 aof the guide member 20, the more the flow velocity distribution isuniformized before the first opening 20 a. However, in the optical pathspace S, the flow velocity on the optical element 3 a side is high, andthe flow velocity on the substrate W side is lower than the flowvelocity on the optical element 3 a side. In this case, the strength ofblowing off the outgas 50 changes in the Z direction. Hence, it ispossible to blow off the most outgas 50 on the substrate W side, and theoutgas 50 having passed the substrate W side can be blown off on theoptical element 3 a side at a high velocity. On the other hand, thefarther the position (Y-axis direction) of the blowing port 11 is fromthe first opening 20 a of the guide member 20, the more the flowvelocity distribution of the gas 42 blown out from the first opening 20a can be uniformized in the optical axis direction. In this case, theeffect of blowing off the outgas 50 of a certain amount can be obtainedin any region in the Z direction. In either case, the outgas reachingthe optical element 3 a can be reduced. In order to prevent the gas 42from entraining the surrounding gas (more reliably maintain the twotypes of flow velocity distributions described above), it is morepreferable that the positional relationship between the second platemember 22 and the optical element 3 a in the flow paths of the gas 43and the gas 42 is expressed by a flat structure as much as possible. Theflat structure is a structure in which the second plate member 22 andthe optical element 3 a are connected in a continuous plane. If the flatstructure cannot be made, a structure with a recess is more preferablethan a structure with a protrusion.

[Gas Used by Second Supplier]

Next, a gas used by the second supplier 8 will be described. The gas 42supplied from the second supplier 8 to the optical path space S flowsnear the optical element 3 a. Hence, the gas 42 is preferably a cleangas that does not fog the optical element 3 a. The clean gas means a gascontaining less impurities such as acids, bases, and organic substancesthan the atmosphere in at least a portion where the outgas 50 has beengenerated. More preferably, a gas (to be called clean air) obtained byremoving impurities such as acids, bases, and organic substances fromair, a gas (to be called clean dry air) obtained by drying the cleanair, an inert gas such as nitrogen gas, or the like may be used.

In some cases, the surrounding gas 41 to be drawn from the secondopening 20 b of the guide member 20 may be a gas contaminated with theoutgas 50. However, if the gas 41 is away from the generation source ofthe outgas 50, it can be treated as a gas cleaner than the outgas 50.Preferably, the surrounding gas 41 in the space where the substratestage 4 is arranged is straightened along a direction (−Y direction)from the second opening 20 b to the first opening 20 a of the guidemember 20. In this case, the surrounding gas 41 to be drawn from thesecond opening 20 b is maintained in a cleaner state than the atmospherein the portion where the outgas 50 has been generated. In thisembodiment, by blowing out the gas 41 from the first supplier 7, a gasflow along the direction (−Y direction) from the second opening 20 b tothe first opening 20 a of the guide member 20 is formed inside thechamber 6. Therefore, the gas to be drawn into the guide member 20 fromthe second opening 20 b is a gas cleaner than the atmosphere in theportion where the outgas 50 has been generated.

[Effect of Second Supplier]

Next, the effect of the second supplier 8 will be described. In order toprevent fogging of the optical element 3 a, it is preferable to supplythe gas 42 to the optical path space S, where light (pattern light) fromthe projection optical system 3 passes through, to blow off, from theoptical path space S, the outgas 50 generated from the substrate W(resist). In order to efficiently blow off the outgas 50 from theoptical path space S as described above, in general, it is desired towidely supply a gas to the optical path space S at a high flow velocity.However, in a conventional gas supply mechanism provided with only thegas blower 10, a gas is locally supplied at a high flow velocity in aportion where the gas is blown out from the blowing port 11 of the gasblower 10. In this case, the gas entrains the surrounding gas near theblowing port 11, and also entrains the outgas 50. Accordingly, when thegas blown out from the blowing port 11 reaches the optical path space S,this can be the gas contaminated with the outgas 50. Further, a flow ofthe outgas 50 toward the optical element 3 a can be generated in theoptical path space S by the gas entrained in the blowing port 11.Accordingly, it can be difficult to effectively blow off the outgas fromthe optical path space S. Increasing the flow amount or the range of thegas blown out from the gas blower 10 leads to consuming the gas in alarger amount. This can be disadvantage in the production cost of asemiconductor device or the like.

On the other hand, in the second supplier 8 according to thisembodiment, the guide member 20 is provided in addition to the gasblower 10. This limits the portion where entrainment occurs due to thegas blower 10 to the second opening 20 b, so that entrainment of theoutgas 50 is reduced. That is, the cleanliness of the gas 42 isimproved. In addition, the gas 43 blown out from the blowing port 11 ofthe gas blower 10 is mixed with the gas 41 drawn from the second opening20 b of the guide member 20 and supplied as the gas 42 from the firstopening 20 a to the optical path space S. That is, the gas 42 of a flowamount larger than the flow amount of the gas 43 blown out from theblowing port 11 can be supplied to the optical path space S. Further,since the flow velocity distribution of the gas blown out from the firstopening 20 a of the guide member 20 is more uniformized than the flowvelocity distribution of the gas near the blowing port 11, the localhigh-flow-velocity distribution of the gas in the optical path space Scan be mitigated. That is, it is possible to reduce the local flowvelocity distribution in the optical path space S, reduce entrainment ofthe outgas 50, and widely supply the gas having a high flow velocity tothe optical path space S. In this manner, as compared with aconventional gas supply mechanism, the second supplier 8 according tothis embodiment can increase the effect of preventing fogging of theoptical element 3 a. Further, the second supplier 8 according to thisembodiment can decrease the gas consumption. Therefore, it can beadvantageous in the production cost of a semiconductor device or thelike.

Second Embodiment

The second embodiment according to the present invention will bedescribed. In this embodiment, a modification of the second supplier 8will be described. Note that this embodiment basically takes over thefirst embodiment, and the arrangement and processing of an exposureapparatus 100 are similar to those in the first embodiment unlessotherwise specified below.

FIG. 8 is a view showing an arrangement example of a second supplier 8according to this embodiment. In addition to the second supplier 8, FIG.8 shows a part of a projection optical system 3 around the secondsupplier 8, a substrate W, and a substrate stage 4. Note that a gasexhauster 9 as shown in each of FIGS. 2A and 2B may also be provided inthe arrangement shown in FIG. 8.

When the temperature and/or humidity of a gas 43 blown out from ablowing port of a gas blower 10 is different from the temperature and/orhumidity of a gas 41 blown out from a first supplier 7, fluctuations mayoccur in the gas around an optical element 3 a. Such fluctuations in thegas influence exposure light (pattern light) for exposing the substrateW and measurement light for measuring the position of the substratestage 4, and this can make it difficult to accurately form a pattern onthe substrate. To prevent this, the second supplier 8 according to thisembodiment includes an air conditioner 14 that regulates the temperatureand/or humidity of the gas 43 to be blown out from the blowing port 11of the gas blower 10. The air conditioner 14 is provided on the upstreamside of the air blower 10 (blowing port 11). The air conditioner 14regulates the temperature and/or humidity of the gas supplied from asecond gas supply source 32, and sends the regulated gas to the gasblower 10 (blowing port 11).

As an example, as shown in FIG. 8, the air conditioner 14 can include atemperature regulator 14 a that regulates the temperature of the gas 43to be blown out from the blowing port 11 and/or a humidity regulator 14b that regulates the humidity of the gas 43. The temperature regulator14 a uses a thermometer 15 a that measures the temperature of the gashaving undergone the temperature regulation and a thermometer 15 b thatmeasures the temperature inside a chamber 6 (the temperature of the gas41 supplied from the first supplier 7) to regulate the temperature ofthe gas 43 to be blown out from the blowing port 11. For example, thetemperature regulator 14 a can regulate the temperature of the gas 43 tobe blown out from the blowing port 11 such that the difference betweenthe measurement result of the thermometer 15 a and the measurementresult of the thermometer 15 b falls within an allowable range. On theother hand, the humidity regulator 14 b uses a hygrometer 16 a thatmeasures the humidity of the gas having undergone the humidityregulation and a hygrometer 16 b that measures the humidity inside thechamber 6 (the humidity of the gas 41 supplied from the first supplier7) to regulate the humidity of the gas 43 to be blown out from theblowing port 11. For example, the humidity regulator 14 b can regulatethe humidity of the gas 43 to be blown out from the blowing port 11 suchthat the difference between the measurement result of the hygrometer 16a and the measurement result of the hygrometer 16 b falls within anallowable range.

As has been described above, the second supplier 8 according to thisembodiment includes the air conditioner 14 (temperature regulator 14 aand humidity regulator 14 b) that regulates the temperature and/orhumidity of the gas 43 to be blown out from the blowing port 11 of thegas blower 10. With this arrangement, gas fluctuations around theoptical element 3 a can be reduced, and the pattern formation accuracyon the substrate can be improved.

Third Embodiment

The third embodiment according to the present invention will bedescribed. In this embodiment, another modification of the secondsupplier 8 will be described. Note that this embodiment basically takesover the first embodiment, and the arrangement and processing of anexposure apparatus 100 are similar to those in the first embodimentunless otherwise specified below. Further, this embodiment can also takeover the arrangement of the second embodiment.

In the second supplier 8 according to the first embodiment, the guidemember 20 is formed in a tubular shape. However, the present inventionis not limited to this. For example, since the guide member 20 isarranged to control entrainment of the surrounding gas 41 into the gas43 blown out from the blowing port 11 of the gas blower 10, the guidemember 20 may be formed in a curved shape (arcuate shape) as long as itsurrounds the blowing port 11. Alternatively, when giving attention topreventing entrainment of the outgas 50 into the gas 43 blown out fromthe blowing port 11, the guide member 20 is not limited to the tubularshape, but it may be formed without left and right side walls as shownin FIG. 9. FIG. 9 is a view of a second supplier 8 when viewed from the−Y direction side. A guide member 20 of the second supplier 8 shown inFIG. 9 includes only a first plate member 21 extended below a blowingport 11 so as to be arranged along the blowing direction (−Y direction)of a gas 43 from the blowing port 11. Note that in addition to the firstplate member 21, the guide member 20 may further include a second platemember 22 extended above the blowing port 11. As compared with thearrangement including only the first plate member 21, the arrangementfurther including the second plate member 22 can improve thecontrollability of entrainment of a surrounding gas 41 into the gas 43blown out from the blowing port 11.

Fourth Embodiment

The fourth embodiment according to the present invention will bedescribed. In this embodiment, still another modification of the secondsupplier 8 will be described. Note that this embodiment basically takesover the first embodiment, and the arrangement and processing of anexposure apparatus 100 are similar to those in the first embodimentunless otherwise specified below. Further, this embodiment can also takeover the arrangement of the second embodiment.

FIG. 10 is a view showing an arrangement example of a second supplier 8according to this embodiment. In addition to the second supplier 8, FIG.10 shows a part of a projection optical system 3 around the secondsupplier 8, a substrate W, and a substrate stage 4. Note that a gasexhauster 9 as shown in each of FIGS. 2A and 2B may also be provided inthe arrangement shown in FIG. 10.

In the second supplier 8 according to this embodiment, a gas blower 10(blowing port 11) is provided on the substrate side (that is, a firstplate member 21) of a guide member 20 as shown in FIG. 10. In this case,in the flow velocity distribution of a gas 42 blown out from the secondsupplier 8, the flow velocity on the substrate side tends to be high.That is, it is possible to blow off an outgas 50 immediately after beinggenerated from the substrate W, so that it is possible to effectivelyblow off the outgas 50 from an optical path space S to prevent theoutgas 50 from reaching an optical element 3 a. Further, in the secondsupplier 8 according to this embodiment, although the flow velocity onthe optical element 3 a side is lower than the flow velocity on thesubstrate side in the flow velocity distribution of the gas 42 blown outfrom the second supplier 8, but the flow velocity and flow amountsufficient for blowing off the outgas can be ensured. Accordingly, evenif the outgas 50 passes on the optical element 3 a side where the flowvelocity of the gas is relatively low, it is possible to prevent theoutgas 50 from reaching the optical element 3 a.

Fifth Embodiment

The fifth embodiment according to the present invention will bedescribed. In this embodiment, still another modification of the secondsupplier 8 will be described. Note that this embodiment basically takesover the first embodiment, and the arrangement and processing of anexposure apparatus 100 are similar to those in the first embodimentunless otherwise specified below. Further, this embodiment can also takeover the arrangement of the second embodiment.

FIG. 11 is a view showing an arrangement example of a second supplier 8according to this embodiment. In addition to the second supplier 8, FIG.11 shows a part of a projection optical system 3 around the secondsupplier 8, a substrate W, and a substrate stage 4. Note that a gasexhauster 9 as shown in each of FIGS. 2A and 2B may also be provided inthe arrangement shown in FIG. 11.

In the second supplier 8 according to this embodiment, a gas blower 10includes a plurality of blowing ports 11. In the example shown in FIG.11, the gas blower 10 includes a first blowing port 11 a provided on anoptical element 3 a side (that is, a second plate member 22) of a guidemember 20, and a second blowing port 11 b provided on a substrate W side(that is, a first plate member 21) of the guide member 20. The supplysource of the gas blown out from the first blowing port 11 a and thesupply source of the gas blown out from the second blowing port 11 b maybe included in a common system, or may be included in different systems.In the arrangement of the second supplier 8 according to thisembodiment, in the flow velocity distribution of a gas 42 blown out fromthe second supplier 8, the flow velocity is high on both of the opticalelement 3 a side and the substrate W side, so that the overall flowvelocity tends to be uniformized. Therefore, it is possible toeffectively blow off an outgas 50 from an optical path space S. Inaddition, since the overall flow velocity can be increased in the heightdirection, even in a case in which the outgas 50 is generated from thesubstrate W across a wide range and the outgas 50 leaks in the lateraldirection (X-axis direction) of the second supplier 8, it is possible toeffectively prevent the outgas 50 from reaching the optical element 3 a.FIG. 11 shows an example in which a plurality of the gas blowers 10extending through the first plate member 21 are provided, but aplurality of the gas blowers 10 extending through the second platemember 22 may be provided.

Sixth Embodiment

The sixth embodiment according to the present invention will bedescribed. In this embodiment, still another modification of the secondsupplier 8 will be described. Note that this embodiment basically takesover the first embodiment, and the arrangement and processing of anexposure apparatus 100 are similar to those in the first embodimentunless otherwise specified below. Further, this embodiment can take overthe arrangement of the second embodiment.

FIG. 12 is a view showing an arrangement example of a second supplier 8according to this embodiment. In addition to the second supplier 8, FIG.12 shows a part of a projection optical system 3 around the secondsupplier 8, a substrate W, and a substrate stage 4. Note that a gasexhauster 9 as shown in each of FIGS. 2A and 2B may also be provided inthe arrangement shown in FIG. 12.

In the second supplier 8 according to this embodiment, a guide member 20has a shape bending midway. At least one blowing port 11 can be arrangedinside the guide member 20. In the arrangement shown in FIG. 12, theblowing port 11 is provided on an optical element 3 a side (that is, asecond plate member 22) of the guide member 20. However, the presentinvention is not limited to this, and the blowing port 11 may beprovided on a substrate W side (that is, a first plate member 21) of theguide member 20, or blowing ports 11 may be provided on both the opticalelement 3 a side and the substrate W side. The arrangement of the secondsupplier 8 according to this embodiment is advantageous in a case inwhich the second supplier 8 cannot be arranged due to spatialrestriction around a projection optical system 3 (optical element 3 a),or the like.

Seventh Embodiment

The seventh embodiment according to the present invention will bedescribed. In this embodiment, an arrangement example of a secondsupplier 8 will be described. Note that this embodiment basically takesover the first embodiment, and the arrangement and processing of anexposure apparatus 100 are similar to those in the first embodimentunless otherwise specified below. Further, this embodiment can also takeover the arrangement of each of the second to sixth embodimentsdescribed above.

In each of the above-described embodiments, an example has beendescribed in which the second supplier 8 is arranged so as to supply thegas 42 to the optical path space S where light (pattern light) from theprojection optical system 3 passes through. However, the presentinvention is not limited to this, and it is also possible to arrange thesecond supplier 8 so as to supply a gas 42 to an optical path spacewhere light (slit-shaped light) from an illumination optical system 1passes through. For example, the second supplier 8 may be arranged so asto supply the gas 42 to a space between the illumination optical system1 and an original M (original stage 2) where light from the illuminationoptical system 1 passes through. Alternatively, the second supplier 8may be arranged so as to supply the gas 42 to a space between theoriginal M (original stage 2) and a projection optical system 3 wherelight transmitted through the original M passes through. With thisarrangement, it is possible to prevent an outgas from reaching anoptical element of the illumination optical system 1 or the original Mand fogging the optical element or the original M.

Here, factors that cause fogging of an optical element of theillumination optical system 1 will be described. In general, not all theparts of the original stage 2 are made of a metal having undergonewashing. For example, there are a resin part, an adhesive agent, and agrease, and even a metal part includes an insufficiently washed area. Inthis case, an outgas can be generated from the resin part, the adhesiveagent, the grease, and the insufficiently washed area. If the outgasreaches an optical element of the illumination optical system 1, itcauses fogging of the optical element. Similarly, if the outgasgenerated from the part of the original stage 2 reaches the original M,it causes fogging of the original M. Further, there is a case in whichthe illumination optical system 1 and/or the projection optical system 3uses, like the original stage 2, a part from which an outgas isgenerated. Also in this case, if the outgas reaches an optical elementof the illumination optical system 1 or the original M, it causesfogging of the optical element or the original M. In the cases asdescribed above, by arranging the second supplier 8 described in each ofthe first to fourth embodiments so as to supply the gas 42 to an opticalpath space of light from the illumination optical system 1, it ispossible to prevent the outgas from reaching the optical element of theillumination optical system 1 and/or the original M. That is, fogging ofthe optical element of the illumination optical system 1 and/or theoriginal M can be reduced (suppressed).

Embodiment of Manufacturing Method of Article

A method of manufacturing an article according to the embodiment of thepresent invention is suitable for manufacturing an article, for example,a microdevice such as a semiconductor device or an element having amicrostructure. The method of manufacturing an article according to theembodiment includes a step of forming a latent pattern to aphotosensitive agent applied onto a substrate (a step of exposing asubstrate) by using the above-described exposure apparatus, and a stepof developing (processing) the substrate on which the latent pattern hasbeen formed in the forming step. Furthermore, this manufacturing methodincludes other well-known steps (for example, oxidization, deposition,vapor deposition, doping, planarization, etching, resist removal,dicing, bonding, packaging, and the like). The method of manufacturingan article according to the embodiment is advantageous in at least oneof the performance, quality, productivity, and production cost of thearticle, as compared with a conventional method.

Other Embodiments

Embodiment(s) of the present invention can also be realized by acomputer of a system or apparatus that reads out and executes computerexecutable instructions (e.g., one or more programs) recorded on astorage medium (which may also be referred to more fully as a‘non-transitory computer-readable storage medium’) to perform thefunctions of one or more of the above-described embodiment(s) and/orthat includes one or more circuits (e.g., application specificintegrated circuit (ASIC)) for performing the functions of one or moreof the above-described embodiment(s), and by a method performed by thecomputer of the system or apparatus by, for example, reading out andexecuting the computer executable instructions from the storage mediumto perform the functions of one or more of the above-describedembodiment(s) and/or controlling the one or more circuits to perform thefunctions of one or more of the above-described embodiment(s). Thecomputer may comprise one or more processors (e.g., central processingunit (CPU), micro processing unit (MPU)) and may include a network ofseparate computers or separate processors to read out and execute thecomputer executable instructions. The computer executable instructionsmay be provided to the computer, for example, from a network or thestorage medium. The storage medium may include, for example, one or moreof a hard disk, a random-access memory (RAM), a read only memory (ROM),a storage of distributed computing systems, an optical disk (such as acompact disc (CD), digital versatile disc (DVD), or Blu-ray Disc (BD)™),a flash memory device, a memory card, and the like.

While the present invention has been described with reference toexemplary embodiments, it is to be understood that the invention is notlimited to the disclosed exemplary embodiments. The scope of thefollowing claims is to be accorded the broadest interpretation so as toencompass all such modifications and equivalent structures andfunctions.

This application claims the benefit of Japanese Patent Application No.2020-113191 filed on Jun. 30, 2020, which is hereby incorporated byreference herein in its entirety.

What is claimed is:
 1. An exposure apparatus that exposes a substrate,comprising: an optical system configured to emit, in a first direction,light for exposing the substrate; a first supplier configured to supplya gas into a chamber where the optical system is arranged; and a secondsupplier configured to supply a gas to an optical path space where thelight from the optical system passes through, wherein the secondsupplier includes a gas blower and a guide member, the gas blowerincluding a blowing port from which a gas is blown out in a seconddirection at a flow velocity higher than a flow velocity of a gas blownout from the first supplier, and the guide member being configured toguide the gas blown out from the blowing port to the optical path space,and the guide member includes a plate member extended on a side of thefirst direction of the blowing port so as to be arranged along thesecond direction in which the gas is blown out from the blowing port. 2.The apparatus according to claim 1, wherein the first supplier supplies,into the chamber, a gas from a first gas supply source, and the secondsupplier supplies, to the optical path space, a gas from a second gassupply source different from the first gas supply source.
 3. Theapparatus according to claim 1, wherein the plate member includes afirst end portion and a second end portion on an opposite side of thefirst end portion, and the first end portion is closer to the opticalpath space than the blowing port, and the second end portion is fartherfrom the optical path space than the blowing port.
 4. The apparatusaccording to claim 3, wherein the first end portion of the plate memberis arranged on a side of the first direction of the optical system. 5.The apparatus according to claim 3, wherein the optical system includesan optical element configured to transmit or reflect light, and thefirst end portion of the plate member is arranged on a side of the firstdirection of a part of the optical element.
 6. The apparatus accordingto claim 1, wherein the gas blower is arranged to be spaced apart fromthe plate member of the guide member.
 7. The apparatus according toclaim 1, wherein the guide member includes a second plate memberextended on an opposite side of the plate member with respect to theblowing port so as to face the plate member, and the gas blower isprovided in the second plate member.
 8. The apparatus according to claim1, wherein the gas blower is provided in the plate member of the guidemember.
 9. The apparatus according to claim 1, wherein the guide memberis formed in a tubular shape whose inner surface is partially defined bythe plate member, the blowing port is arranged inside the guide member,and an area of the blowing port is smaller than a sectional area of theguide member.
 10. The apparatus according to claim 9, wherein the guidemember formed in the tubular shape includes a first opening and a secondopening on an opposite side of the first opening; and the first openingis closer to the optical path space than the blowing port, and thesecond opening is farther from the optical path space than the blowingport.
 11. The apparatus according to claim 9, wherein the gas blowerincludes a first tube portion including the blowing port as one end andarranged inside the guide member, and a second tube portion extendingthrough the guide member and communicating to the other end of the firsttube portion.
 12. The apparatus according to claim 1, wherein the secondsupplier includes a temperature regulator configured to regulate atemperature of the gas to be blown out from the blowing port.
 13. Theapparatus according to claim 1, wherein the second supplier includes ahumidity regulator configured to regulate a humidity of the gas to beblown out from the blowing port.
 14. The apparatus according to claim 1,wherein the gas blower includes a plurality of blowing ports.
 15. Theapparatus according to claim 1, further comprising a gas exhausterconfigured to exhaust a gas in the optical path space.
 16. The apparatusaccording to claim 1, wherein the optical system is a projection opticalsystem that projects a pattern image to the substrate, and the opticalpath space is a space between the projection optical system and thesubstrate where light from the projection optical system passes through.17. The apparatus according to claim 1, wherein the optical system is anillumination optical system that illuminates an original, and theoptical path space is at least one of a space between the illuminationoptical system and the original where light from the illuminationoptical system passes through and a space where the light transmittedthrough the original passes through.
 18. A method of manufacturing anarticle, the method comprising: exposing a substrate using an exposureapparatus defined in claim 1; and developing the substrate exposed inthe exposing, wherein the article is manufactured from the developedsubstrate.